HUAWEI KIMFLY M6 FLASH FILE PAC CLONE SPD7731 6.0 100% TESTED PAC FIRMWARE BY AH BIPLOB

HUAWEI KIMFLY M6 OR M1 PAC FLASH FILE CLONE

HUAWEI KIMFLY OR M1 PAC FIRMWARE CLONE

HUAWEI KIMFLY OR M1 PAC STOCK ROOM CLONE

SP7731CEB_sp7731c_1h10_32v4_6.0_MRA58K_release-keys_M1

SP7731CEB_sp7731c_1h10_32v4_6.0_MRA58K_release-keys_M1

Phone found! [ 3 ]
Port Opened
Sync...
InitBoot Done [ 0x81 ] , Ver : SPRD3
Sync...
Sending FDL
[Info] : If SW freeze here more, than 15 seconds - remove cable
FDL Ready!
Boot Ver : SC7731 Crev eMMC Loader v2.0    
Sending FLASH FDL
FLASH FDL Ready!
Boot Ok!

Model Name  : sp7731c_1h10_32v4_oversea
Model Brand : M1
Model Device: sp7731c_1h10_32v4
AndrVersion : 6.0
BaseBand CPU: SP7731CEB
Project Ver : MRA58K release-keys
Model Ext   : M1

[Read Mode] : HSUSB : 0x3000

[FW_READER] : Reading Firmware Now ...

[Read Ok] : u-boot-spl-16k.bin
[Read Ok] : u-boot.bin
[Read Ok] : prodnv.img
[Read Ok] : sc7731C_CP0_modem.bin
[Read Ok] : DSP_DM_Gx.bin
[Read Ok] : nvitem_w.bin
[Read Ok] : sc8830g_modem_CP2_WCN_Trunk_W16.28.5_Release.bin
[Read Ok] : nvitem_wcn.bin
[Read Ok] : logo_720x1280.bin
[Read Ok] : logo2.bin
[Read Ok] : logo3.bin
[Read Ok] : logo4.bin
[Read Ok] : logo5.bin
[Read Ok] : logo6.bin
[Read Ok] : logo7.bin
[Read Ok] : logo8.bin
[Read Ok] : logo9.bin
[Read Ok] : logo10.bin
[Read Ok] : boot.img
[Read Ok] : system.img
[Build Ok] : cache.img
[Read Ok] : recovery.img
[Read Ok] : sysinfo.img
[Build Ok] : userdata.img

AndroidInfo created
Firmware Size : 1646 MiB
Saved to : C:\Users\Easy China Firmware\Desktop\ok\SP7731CEB_sp7731c_1h10_32v4_6.0_MRA58K_release-keys_M1\
Done!